Call for papers

The International Conference on Integrated Circuits, Design, and Verification (ICDV) provides a forum for exchanging ideas, discussing research results, and presenting chips, circuit designs, and applications in the fields of solid-state and semiconductor technologies. Continuous scaling of the CMOS devices increases the number of transistors on a VLSI chip. It reaches 100 billion transistors per chip, surpassing the total number of neurons in the human brain. This would certainly provide a great opportunity for new applications and information processing. On the other hand, the small feature size causes new problems, such as leakage current and process variation. To discuss leveraging the scaling advantages and addressing new problems, we call for contributions on new proposals for application systems, VLSI architectures, and design methodologies, as well as technologies and applications in the integrated circuits and devices field. We expect this conference to explore and stimulate the contributed research on those subjects. The papers are solicited from prospective authors interested in the related fields.

The ICDV 2026 conference is organized by IEEE CASS & SSCS Vietnam Chapter, co-hosted by Le Quy Don Technical University (LQDTU) and VNU Information Technology Institute (VNU-ITI), technically supported by the IEICE Vietnam Section. The ICDV 2026 will be held in Hanoi, Vietnam. Further information about the conference, paper submission guidelines and templates will be updated on the website.

Paper submission

Prospective authors are invited to submit full-length, six-page manuscripts, including figures, tables and references, to the official ICDV 2026 website. All papers will be handled electronically. Accepted and presented papers will be included in the conference proceedings with ISBN and will be submitted for inclusion in IEEE Xplore® subject to meeting IEEE Xplore’s scope and quality requirements (the copyright shall be assigned to the IEEE). The proceedings of ICDV series are regularly indexed by Scopus and listed in conference proceeding citation index (CPCI) of Clarivate. Papers are solicited in the following categories, but are not limited to:

1. Digital integrated circuits and signal processing
2. Memory and Processors/multiprocessors design
3. Analog and mixed-signal circuits
4. RF integrated circuits and microwave engineering
5. Advanced packaging and semiconductor design
6. Photonics devices, circuits, and systems
7. Circuit and advanced design technologies
8. Circuits/devices modeling, verification, and testing
9. Reconfigurable architectures & FPGA-based designs
10. Embedded systems design
11. AI & IoT-related circuits, devices, and applications
12. Rebooting computing
13. Hardware security, cryptography
14. Industrial IoT devices and systems.

Special Sections

• Quantum computing and quantum AI
• TBD

Important dates

• Full manuscript submission: May 30, 2026
• Notification of acceptance: July 20, 2026
• Camera-ready submission: August 20, 2026

Steering co-Chairs

• Xuan-Nam Tran, LQDTU, Vietnam
• Makoto Ikeda, Uni. of Tokyo, Japan

General co-Chairs

• Xuan-Tu Tran, CASS, Vietnam
• Cong-Kha Pham, UEC, Japan
• Van-Phuc Hoang, LQDTU, Vietnam

Technical program co-chairs

• Koichiro Ishibashi, UTM, Malaysia
• Quang-Kien Trinh, LQDTU, Vietnam
• Mai-Khanh Nguyen Ngoc, SJSU, United States
• Duc-Hung Le, HCMUS, Vietnam

Publication co-Chairs

• Duy-Hieu Bui, VNU-ITI, Vietnam
• Huu Hung Nguyen, LQDTU, Vietnam
• Nguyen Dinh Tuan, LQDTU, Vietnam
• Xuan Thanh Pham, HaUI, Vietnam

Local Arrangement Chairs

• Quoc Dinh Nguyen, LQDTU, Vietnam
• Quy Thang Bui, LQDTU, Vietnam
• Dao Dinh Ha, LQDTU, Vietnam

Special Session Chair

• Anh-Tuan Do, A*STAR, Singapore
• Trong Thuc Hoang, UEC, JP
• Pham Nguyen Thanh Loan, HUST

Publicity co-Chairs

• Massimo Alioto, NUS, Singapore
• Khanh N. Dang, UoA, Japan
• Thanh-Toan Dao, UTC, Vietnam
• Nguyen Hoang Vu, LQDTU, Vietnam
• Ha Manh Thang, LQDTU, Vietnam

Secretary

• Van-Trung Nguyen, LQDTU, Vietnam